Board to Board Connector FQ FQ 2,54 Series Socket-FQ 2,54D/ 10-SH-0-BT
Board to Board Connector FQ FQ 2,54 Series Socket-FQ 2,54D/ 10-SV-1020-1-BT
Board to Board Connector FQ FQ 2,54 Series Socket-PHOENIX CONTACT

Board to Board Connector FQ FQ 2,54 Series Socket
PHOENIX CONTACT


About This Product

■Application-oriented and cost-optimized design for flexible use The FQ series general-purpose board-to-board connectors are extremely versatile. Universal pin headers and sockets with 1.27mm and 2.5mm pitches are the basis for compact printed circuit board connections inside equipment. It features an application-oriented and cost-optimized design. Pin headers and sockets can implement mezzanine, coplanar, and mother/daughter connections. ■Flexible equipment design The double-contact system of reliable mechanical and electrical connections gives equipment manufacturers a high degree of freedom. ■Accurate positioning Locating pins on the bottom for reliable mechanical and electrical connections ■Automatic implementation Coplanarity, tape-on-reel or magazine packaging, and suction plates allow automatic reflow processes. ■Automatic quality control A soldered joint extending from the bottom of the case allows for simple automated visual inspection. ■Very cost-effective A simple, cost-optimized design provides a cost-effective solution for in-device printed circuit board connections.

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    Board to Board Connector FQ FQ 2,54 Series Socket

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10 Models of Board to Board Connector FQ FQ 2,54 Series Socket

Items marked with have different values depending on the model number.

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Product Image Part Number Price (excluding tax) CTI, IEC 60112 compliant Classification temperature Tc Color (housing) Contact cover Contact material Contact resistance Insulating material group Insulation material Length of overlap Metal surface treatment Contact part (base) Metal surface treatment Contact part (finish) Metal surface treatment Soldering part (finishing) Moisture Sensitivity Level (MSL) Mounting type Number of poles Number of rows Packing type Pad shape Pin arrangement Pitch Pollution degree Process Stack height Standard IN Surface properties UL94 flame retardant class Withstand voltage

FQ 2,54D/ 30-SH-0-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 30 2 Tube magazine 1.04 x 1.32mm Linear pad shape 2.54mm 3 Reflow soldering - 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003

FQ 2,54D/ 50-SH-0-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 50 2 Tube magazine 1.04 x 1.32mm Linear pad shape 2.54mm 3 Reflow soldering - 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003
Board to Board Connector FQ FQ 2,54 Series Socket-Part Number-FQ 2,54D/ 10-SH-0-BT

FQ 2,54D/ 10-SH-0-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 10 2 Tube magazine 1.04 x 1.32mm Linear pad shape 2.54mm 3 Reflow soldering - 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003
Board to Board Connector FQ FQ 2,54 Series Socket-Part Number-FQ 2,54D/ 10-SV-1020-1-BT

FQ 2,54D/ 10-SV-1020-1-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 10 2 Tube magazine 1.04 x 3.38mm Linear pad shape 2.54mm 3 Reflow soldering 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-PV) 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003

FQ 2,54D/ 20-SH-0-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 20 2 Tube magazine 1.04 x 1.32mm Linear pad shape 2.54mm 3 Reflow soldering - 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003

FQ 2,54D/ 50-SV-1020-1-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 50 2 Tube magazine 1.04 x 3.38mm Linear pad shape 2.54mm 3 Reflow soldering 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-PV) 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003

FQ 2,54D/ 20-SV-1020-1-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 20 2 Tube magazine 1.04 x 3.38mm Linear pad shape 2.54mm 3 Reflow soldering 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-PV) 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003

FQ 2,54D/ 30-SV-1020-1-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 30 2 Tube magazine 1.04 x 3.38mm Linear pad shape 2.54mm 3 Reflow soldering 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-PV) 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003

FQ 2,54D/ 80-SH-0-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 80 2 Tube magazine 1.04 x 1.32mm Linear pad shape 2.54mm 3 Reflow soldering - 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003

FQ 2,54D/ 80-SV-1020-1-BT

Available upon quote 600 260℃ Black (9005) 0.4mm Copper alloy 20 mΩ I P.A. 1.3mm Nickel (Ni) Gold (Au) Suzu (Sn) MSL 1 SMD solder connection 80 2 Tube magazine 1.04 x 3.38mm Linear pad shape 2.54mm 3 Reflow soldering 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-PV) 3 A (at 20℃, 80 poles) Selective coating V0 500V AC IEC 60512-4-1:2003

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