Product
Board to Board Connector FQ FQ 2,54 Series Pin HeaderHandling Company
PHOENIX CONTACTCategories
Items marked with have different values depending on the model number.
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Product Image | Part Number | Price (excluding tax) | CTI, IEC 60112 compliant | Classification temperature Tc | Color (housing) | Contact cover | Contact material | Contact resistance | Insulating material group | Insulation material | Length of overlap | Metal surface treatment Contact part (base) | Metal surface treatment Contact part (finish) | Metal surface treatment Soldering part (finishing) | Moisture Sensitivity Level (MSL) | Mounting type | Number of poles | Number of rows | Packing type | Pad shape | Pin arrangement | Pitch | Pollution degree | Process | Stack height | Standard IN | Surface properties | UL94 flame retardant class | Withstand voltage |
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FQ 2,54D/ 50-PV- 380-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 50 | 2 | Tube magazine | 1.02 x 3.4mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-SV) | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 10-PV- 380-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 10 | 2 | Tube magazine | 1.02 x 3.4mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-SV) | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 20-PH-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 20 | 2 | Tube magazine | 1.3 x 2.8mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | - | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 30-PV- 380-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 30 | 2 | Tube magazine | 1.02 x 3.4mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-SV) | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 50-PH-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 50 | 2 | Tube magazine | 1.3 x 2.8mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | - | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 10-PH-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 10 | 2 | Tube magazine | 1.3 x 2.8mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | - | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 20-PV- 380-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 20 | 2 | Tube magazine | 1.02 x 3.4mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-SV) | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 80-PH-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 80 | 2 | Tube magazine | 1.3 x 2.8mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | - | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 30-PH-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 30 | 2 | Tube magazine | 1.3 x 2.8mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | - | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 2,54D/ 80-PV- 380-1-BT |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 80 | 2 | Tube magazine | 1.02 x 3.4mm | Linear pad shape | 2.54mm | 3 | Reflow soldering | 13.6 mm Error range: +1.3 mm (combined product range: FQ 2,54D/...-SV) | 3 A (at 20℃, 80 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
Click on the part number for more information about each product