Board to Board Connector FQ 1,27 Series Pin Header
PHOENIX CONTACT
About This Product
■Application-oriented and cost-optimized design for flexible use
The FQ series general-purpose board-to-board connectors are extremely versatile. Universal pin headers and sockets with 1.27mm and 2.5mm pitches are the basis for compact printed circuit board connections inside equipment.
It features an application-oriented and cost-optimized design. Pin headers and sockets can implement mezzanine, coplanar, and mother/daughter connections.
■Flexible equipment design
The double-contact system of reliable mechanical and electrical connections gives equipment manufacturers a high degree of freedom.
■Accurate positioning
Locating pins on the bottom for reliable mechanical and electrical connections
■Automatic implementation
Coplanarity, tape-on-reel or magazine packaging, and suction plates allow automatic reflow processes.
■Automatic quality control
A soldered joint extending from the bottom of the case allows for simple automated visual inspection.
■Very cost-effective
A simple, cost-optimized design provides a cost-effective solution for in-device printed circuit board connections.
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Product
Board to Board Connector FQ 1,27 Series Pin Header
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Handling Company
PHOENIX CONTACT
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Categories
5 Models of Board to Board Connector FQ 1,27 Series Pin Header
Items marked with have different values depending on the model number.
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| Product Image | Part Number | Price (excluding tax) | CTI, IEC 60112 compliant | Classification temperature Tc | Color (housing) | Contact cover | Contact material | Contact resistance | ESD level | Insulating material group | Insulation material | Length of overlap | Metal surface treatment Contact part (base) | Metal surface treatment Contact part (finish) | Metal surface treatment Soldering part (finishing) | Moisture Sensitivity Level (MSL) | Mounting type | Number of poles | Number of rows | Packing specifications specifications | Packing type | Pad shape | Pin arrangement | Pitch | Pollution degree | Process | Stack height | Standard IN | Surface properties | Type of external packaging | UL94 flame retardant class | Withstand voltage |
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FQ 1,27D/ 10-PV- 160-1-BR |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | (D) Electrostatically conductive | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 10 | 2 | DIN EN 61340-5-1 (VDE 0300-5-1) : 2008-07 | 16 mm wide tape | 0.76 x 2.4mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 6.2 mm Error range: +1.3 mm (combined product range: FQ 1,27D/...-SV) | 1 A (at 20℃, 80 poles) | Selective coating | Transparent bag | V0 | 500V AC IEC 60512-4-1:2003 |
FQ 1,27D/ 20-PV- 160-1-BR |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | (D) Electrostatically conductive | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 20 | 2 | DIN EN 61340-5-1 (VDE 0300-5-1) : 2008-07 | 24 mm wide tape | 0.76 x 2.4mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 6.2 mm Error range: +1.3 mm (combined product range: FQ 1,27D/...-SV) | 1 A (at 20℃, 80 poles) | Selective coating | Transparent bag | V0 | 500V AC IEC 60512-4-1:2003 | |
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FQ 1,27D/ 80-PV- 160-1-BR |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | (D) Electrostatically conductive | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 80 | 2 | DIN EN 61340-5-1 (VDE 0300-5-1) : 2008-07 | 72 mm wide tape | 0.76 x 2.4mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 6.2 mm Error range: +1.3 mm (combined product range: FQ 1,27D/...-SV) | 1 A (at 20℃, 80 poles) | Selective coating | Transparent bag | V0 | 500V AC IEC 60512-4-1:2003 |
FQ 1,27D/ 30-PV- 160-1-BR |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | (D) Electrostatically conductive | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 30 | 2 | DIN EN 61340-5-1 (VDE 0300-5-1) : 2008-07 | 32 mm wide tape | 0.76 x 2.4mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 6.2 mm Error range: +1.3 mm (combined product range: FQ 1,27D/...-SV) | 1 A (at 20℃, 80 poles) | Selective coating | Transparent bag | V0 | 500V AC IEC 60512-4-1:2003 | |
FQ 1,27D/ 50-PV- 160-1-BR |
Available upon quote | 600 | 260℃ | Black (9005) | 0.4mm | Copper alloy | 20 mΩ | (D) Electrostatically conductive | I | P.A. | 1.3mm | Nickel (Ni) | Gold (Au) | Suzu (Sn) | MSL 1 | SMD solder connection | 50 | 2 | DIN EN 61340-5-1 (VDE 0300-5-1) : 2008-07 | 44 mm wide tape | 0.76 x 2.4mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 6.2 mm Error range: +1.3 mm (combined product range: FQ 1,27D/...-SV) | 1 A (at 20℃, 80 poles) | Selective coating | Transparent bag | V0 | 500V AC IEC 60512-4-1:2003 |
Click on the part number for more information about each product
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