Board-to-board connector FR series SMD male connector
PHOENIX CONTACT
About This Product
■1.27mm pitch high-speed data transmission
Are you looking for a compatible replacement for future industrial requirements with a built-in 1.27mm pitch board-to-board connection? The FR 1,27 series is the ideal solution. Take advantage of high-speed data transmission and efficient design-in.
■Features
- Robust 6-way to 100-way board-to-board and wire-to-board connectors compatible with market-established standards
- Expand application options with significantly improved high-speed data transmission up to 28Gbps
・Save time during the development process with customer-specific simulations for data quality
・Gold-plated contacts provide stable signal transmission over long periods of time and support current up to 2.3A.
*Other product numbers are available.
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Product
Board-to-board connector FR series SMD male connector
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Handling Company
PHOENIX CONTACT
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Categories
10 Models of Board-to-board connector FR series SMD male connector
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Angle tolerance | CTI, IEC 60112 compliant | Center offset | Classification temperature Tc | Color (housing) | Contact cover | Contact material | Contact resistance | Insulating material group | Insulation material | Length of overlap | Metal surface treatment Contact part (base) | Metal surface treatment Contact part (finish) | Metal surface treatment Soldering part (base) | Metal surface treatment Soldering part (finishing) | Moisture Sensitivity Level (MSL) | Mounting type | Number of poles | Number of reflow soldering | Number of rows | Packing type | Pad shape | Pin arrangement | Pitch | Pollution degree | Process | Standard IN | Surface properties | UL94 flame retardant class | Withstand voltage |
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FR 1,27/ 32-MV 1,75 |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 32 | 3 | 2 | 44 mm wide tape | 0.8 x 1.1mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2.2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 840V AC IEC 60512-4-1:2003 |
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FR 1,27/ 40-MH |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 40 | 3 | 2 | 44 mm wide tape | 0.8x0.8mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FR 1,27/ 12-MH |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 12 | 3 | 2 | 24 mm wide tape | 0.8x0.8mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FR 1,27/ 40-MV 1,75 |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 40 | 3 | 2 | 44 mm wide tape | 0.8 x 1.1mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2.2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 840V AC IEC 60512-4-1:2003 |
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FR 1,27/ 40-MV 3,25 |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 40 | 3 | 2 | 44 mm wide tape | 0.8 x 1.1mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2.2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 840V AC IEC 60512-4-1:2003 |
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FR 1,27/ 20-MV 3,25 |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 20 | 3 | 2 | 32 mm wide tape | 0.8 x 1.1mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2.2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 840V AC IEC 60512-4-1:2003 |
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FR 1,27/ 32-MH |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 32 | 3 | 2 | 44 mm wide tape | 0.8x0.8mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FR 1,27/100-MH |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 100 | 3 | 2 | 88 mm wide tape | 0.8x0.8mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FR 1,27/ 6-MV 3,25 |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 6 | 3 | 2 | 24 mm wide tape | 0.8 x 1.1mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2.2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 840V AC IEC 60512-4-1:2003 |
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FR 1,27/ 80-MV 3,25 |
Available upon quote | ± 5° vertical and horizontal | 150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.9mm | Copper alloy | 10 mΩ | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 80 | 3 | 2 | 72 mm wide tape | 0.8 x 1.1mm | Linear pad shape | 1.27mm | 3 | Reflow soldering | 2.2 A IEC 60512-5-2:2002-02 (at 20℃, 100 pins) | Selective coating | V0 | 840V AC IEC 60512-4-1:2003 |
Click on the part number for more information about each product
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