Board-to-board connector FP 0,8 series SMD male connector, shielded
PHOENIX CONTACT
About This Product
■Shielded and unshielded, 0.8 mm pitch
The board-to-board connector FP 0,8 series features innovative ScaleX technology. Unique double contacts ensure a reliable and robust connection and high tolerance compensation during mating. Excellent signal integrity makes it ideal for high-speed data transmission up to 52Gbps.
The shielded version is optimized for very high levels of electromagnetic compatibility (EMC). Versatile attributes make the FP0,8 series ideal for industrial applications where ruggedness, high speed data transmission, and shielding are required.
■Double contact system
Double ScaleX contact system allows mating length with 1.5mm range of motion. This ensures a reliable mechanical and electrical connection.
■Flexible device settings
Different pin counts, designs, stacking heights from 6 to 18 mm and future planned versions offer great freedom in equipment design.
■Robust plug connection
ScaleX technology ensures high tolerance compensation and provides a housing shape that protects the contacts.
■Data speed is as high as 52Gbps
The FP 0,8 series offers exceptional signal integrity (digital signal quality). High EMC protection with excellent shielding concept (optional).
■A wide variety of variations in just one series
With the same tolerances, stacking heights and mechanical properties, shielded and unshielded versions allow a wide range of applications.
■Advanced EMC protection
Secure data transmission up to 52Gbps thanks to clever shielding concept: We offer unique shielded and unshielded board-to-board connectors in the same product range. The same tolerances, stacking height and mechanical properties allow uniform process parameters, especially in applications where both versions are installed on one printed circuit board.
The wide range of product variations also ensures high flexibility during design-in for series production.
*Other product numbers are available.
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Product
Board-to-board connector FP 0,8 series SMD male connector, shielded
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Handling Company
PHOENIX CONTACT
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Categories
10 Models of Board-to-board connector FP 0,8 series SMD male connector, shielded
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Angle tolerance | CTI, IEC 60112 compliant | Center offset | Classification temperature Tc | Color (housing) | Contact cover | Contact material | Contact resistance | Electrical properties | Insulating material group | Insulation material | Length of overlap | Metal surface treatment Contact part (base) | Metal surface treatment Contact part (finish) | Metal surface treatment Soldering part (base) | Metal surface treatment Soldering part (finishing) | Moisture Sensitivity Level (MSL) | Mounting type | Number of poles | Number of potentials | Number of rows | Offset in the X direction (length direction) | Pin arrangement | Pitch | Pollution degree | Process | Standard IN | Surface properties | UL94 flame retardant class | Withstand voltage |
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FP 0,8/ 12-MV-SH 2,65 |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 15 mΩ | Shield compatible | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 12 | 12 | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 80 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 52-MV-SH 8,65 |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 25 mΩ | - | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 52 | - | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 80 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 80-MV-SH 2,65 |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 15 mΩ | Shield compatible | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 80 | 80 | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 80 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 80-MH-SH |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 25 mΩ | Shield compatible | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 80 | 80 | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 80 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 12-MV-SH 1,15 |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 20 mΩ | Shield compatible | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 12 | 12 | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 52 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 12-MH-SH |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 25 mΩ | Shield compatible | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 12 | 12 | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 80 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 52-MH-SH |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 25 mΩ | Shield compatible | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 52 | 52 | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 80 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 32-MV-SH 1,15 |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 20 mΩ | Shield compatible | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 32 | 32 | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 52 poles) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 20-MV-SH 2,65 |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | 260℃ | Black (9005) | 0.8mm | Copper alloy | 15 mΩ | Shield compatible | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 20 | 20 | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | Reflow soldering | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 80 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
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FP 0,8/ 32-MV-SH 7,15 |
Available upon quote |
± 5° vertical and horizontal (when mated) ± 5° vertical and horizontal (when mated) |
150 | ± 0.7 mm vertically and horizontally | - | Black (9005) | 0.8mm | Copper alloy | 25 mΩ | - | IIIb | LCP | 1.5mm | Nickel (Ni) | Gold (Au) | Nickel (Ni) | Suzu (Sn) | MSL 1 | SMD solder connection | 32 | - | 2 | ± 0.3 mm (tolerance correction when plug is inserted) | Linear pad shape | 0.8mm | 3 | - | 1.7 A IEC 60512-5-2:2002-02 (at 20℃, 80 pins) | Selective coating | V0 | 500V AC IEC 60512-4-1:2003 |
Click on the part number for more information about each product
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