Next-generation embedded system MX1-10FEP such as excellent performance and powerful processors-MX1-10FEP
Next-generation embedded system MX1-10FEP such as excellent performance and powerful processors-Fuji Soft Co., Ltd.

Next-generation embedded system MX1-10FEP such as excellent performance and powerful processors
Fuji Soft Co., Ltd.


About This Product

■ Overview / features MITAC Computing Technology MX1-10FEP embedded system is Intel® Coffee Lake C246 Requested Assembly System equipped with Workstation Chipset, which supports Intel® Xeon® and Core-I LGA1151 socket type processors. It is. Excellent performance, powerful processors, OCP/OVP power protection and expandable design provide solutions to all complex tasks and most types of applications. MX1-10FEP's 7.8-liter fan lescasi design and expandable module design enables complex tasks to implement complex tasks in all workspace and environment. The VESA mounting hole allows you to save space and attach it to the VESA arm to the back. Abundant I/O ports array (Ethernet RJ45 X 2, USB X 8, HDMI X 1, DVI-I X 1, DisplayPort X 1, COM 2, PCIE X16 slot, 3pin terminal block power input, and 3x extensions. The door is possible to connect to various peripherals. Storage expandability is supported by a 2.5 -inch HDD bracket design 3 x high density hard drive. Two MPCIE (shared with MSATA) support SSDs and wireless interfaces that enable simple connections to Wi-Fi and Bluetooth networks and 4G connections. The DIO/COM/LAN/PoE/Power Ignitoin extension module extends the functions and possibilities used in more applications. ■ Specifications: Front I/O 1 X HDMI 1.4/2 X USB 3.0/2 X SIM Card Slot Cover/1 x 2.5 inch SATAIII HDD/SSD Bay * There are other specifications.

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    Next-generation embedded system MX1-10FEP such as excellent performance and powerful processors




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1 Models of Next-generation embedded system MX1-10FEP such as excellent performance and powerful processors

Product Image Part Number Price (excluding tax) CPU Chipset Dimensions (W × D × H) Display interface Ethernet Expansion slot LTE/wireless Expansion slot storage Graphics I/O chipset Impact resistance Input Power Internal speaker OS support Operating temperature Operation humidity Power adapter Storage slot System memory Thermal design Vibration resistance attachment audio certification indicator weight
Next-generation embedded system MX1-10FEP such as excellent performance and powerful processors-Part Number-MX1-10FEP

MX1-10FEP

Available upon quote 8th generation Intel® COFFEE LAKE XEON/Core-I LGA1151 Socket processor, TDP Max, 80W Intel® C246 268 x 246 x 108 mm DisplayPort 1.2/DVI-I/HDMI 1.4 Intel® I219-LM Giga LAN + I210-IT Giga LAN MINI PCIe full size (USB/PCIE), SIM card holder (with full to half -size adapter plate) MPCIE full size (USB/PCIE/SATA) Intel®HD graphics Nuvoton NCT6116D At the time of operation: 50 GRMS, semi-string wave 11 ms duration (with SSD, compliance with IEC60068-27) 9 ~ 48V Wide Range DC input, terminal block connection 1 x buzzer Windows 10 64 -bit/Linux (Request Support) 35W TDP processor: -40 ~ 70 ° C/51 ~ 65W TDP processor: -40 ~ 50 ° C/71 ~ 80W TDP processor: -40 ~ 40 ° C/air flow 0.7 m/second and wide temperature memory/storage 10 ~ 90 % R/H (no condensation) optional 3 x 2.5 HDD/SSD (1x removable HDD Bay, 2 W/internal HDD bracket)/2 x MSATA/1 x M.2 M key SSD Up to 32GB (Xeon: ECC/NON-ECC; Core-i: Non-ECC)/DDR4 2,666MHz/2 x 260 Pin So-Dimm Fanless At the time of operation: 5 ~ 500Hz/5GRMS/3AXIS (with SSD, IEC60068-2-64 compliant) Wall mount REALTEK®ALC662 CE/FCC Class A/E Mark/EN50155 DIO LED/LAN1 & 2 ACT/Speed/Power LED/HDD LED 6

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About Company Handling This Product

Fuji Soft Co., Ltd.

  • Japan
  • Since 1970
  • 9,570 employees

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