Product
Next-generation embedded system MX1-10FEP such as excellent performance and powerful processorsHandling Company
Fuji Soft Co., Ltd.Product Image | Part Number | Price (excluding tax) | CPU | Chipset | Dimensions (W × D × H) | Display interface | Ethernet | Expansion slot LTE/wireless | Expansion slot storage | Graphics | I/O chipset | Impact resistance | Input Power | Internal speaker | OS support | Operating temperature | Operation humidity | Power adapter | Storage slot | System memory | Thermal design | Vibration resistance | attachment | audio | certification | indicator | weight |
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MX1-10FEP |
Available upon quote | 8th generation Intel® COFFEE LAKE XEON/Core-I LGA1151 Socket processor, TDP Max, 80W | Intel® C246 | 268 x 246 x 108 mm | DisplayPort 1.2/DVI-I/HDMI 1.4 | Intel® I219-LM Giga LAN + I210-IT Giga LAN | MINI PCIe full size (USB/PCIE), SIM card holder (with full to half -size adapter plate) | MPCIE full size (USB/PCIE/SATA) | Intel®HD graphics | Nuvoton NCT6116D | At the time of operation: 50 GRMS, semi-string wave 11 ms duration (with SSD, compliance with IEC60068-27) | 9 ~ 48V Wide Range DC input, terminal block connection | 1 x buzzer | Windows 10 64 -bit/Linux (Request Support) | 35W TDP processor: -40 ~ 70 ° C/51 ~ 65W TDP processor: -40 ~ 50 ° C/71 ~ 80W TDP processor: -40 ~ 40 ° C/air flow 0.7 m/second and wide temperature memory/storage | 10 ~ 90 % R/H (no condensation) | optional | 3 x 2.5 HDD/SSD (1x removable HDD Bay, 2 W/internal HDD bracket)/2 x MSATA/1 x M.2 M key SSD | Up to 32GB (Xeon: ECC/NON-ECC; Core-i: Non-ECC)/DDR4 2,666MHz/2 x 260 Pin So-Dimm | Fanless | At the time of operation: 5 ~ 500Hz/5GRMS/3AXIS (with SSD, IEC60068-2-64 compliant) | Wall mount | REALTEK®ALC662 | CE/FCC Class A/E Mark/EN50155 | DIO LED/LAN1 & 2 ACT/Speed/Power LED/HDD LED | 6 |