Acquisition of analysis flows that are optimal for electronic device thermal design Simcenter Flotherm XT
IDAJ Co., Ltd.
About This Product
Semiconductor package "Simcenter ™ Flotherm ™ XT", which can analyze from the single to the entire device, is a thermal design support tool that can be used by all corporate thermal design representatives that make up the supply chain of various electronic devices. It can be applied to the heat design of various electronic devices, such as communication modules, smartphones, motors and head -up displays.
Achieves the optimal analysis flow for electronic equipment heat design
■ Create a model from each data you get
1. Print wiring plate
You can easily create a board analysis model by incorporating the data output from the board CAD.
2. Semiconductor package
In order to predict the temperature of each part of the semiconductor package, such as the junction temperature, the temperature of each part of each part, it is necessary to model the internal structure accurately. Semicenter Flotherm Package Creator and semiconductor package parts data creation web tools installed in the Simcenter Flotherm XT, semiconductor package thermos analysis detail models for thermal analysis. You can use it.
3. housing / mechanical shape
GUI is easy to use if you are used to a 3D CAD, and create and set an analysis model.
■ Analysis execution -Results processing
1. Mesh generation
The unique "multi -control volume" concept using the cut cell can automatically create a mesh for curved surfaces and diagonal shapes.
2. Analysis execution
Not only regular analysis and transient analysis, but also analysis in consideration of joule fever and rotation.
3. Confirmation of analysis results
The processing of the analysis results can be operated on the same screen as the shape creation and analysis settings.
■ Convenient function for efficiently promoting heat flow analysis
1. Parametric analysis function
Parameter analysis with shapes and physical properties as a variable is possible.
2.T3Ster calibration function
The thermal resistance data and structural function obtained from the measurement results can be output in the Simcenter Flotherm XT format.
3. The output function of the low -dimensional model
You can output a conductive analysis model created by SimCenter Flotherm XT as a low -dimensional model.
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Product
Acquisition of analysis flows that are optimal for electronic device thermal design Simcenter Flotherm XT
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Handling Company
IDAJ Co., Ltd.
1 Models of Acquisition of analysis flows that are optimal for electronic device thermal design Simcenter Flotherm XT
| Product Image | Part Number | Price (excluding tax) | Linux, 64-bit | Mesh creation | Model creation | Result processing | Windows 64-bit | analysis |
|---|---|---|---|---|---|---|---|---|
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SimCenter Flotherm XT |
Available upon quote |
Red Hat Enterprise Linux 7.3 (Solver Only) Red Hat Enterprise Linux 7.6 (Solver Only) Such |
Automatic mesh creation (cut cell) Local grid (local mesh division) Surface expansion grid (mesh control in the surface surrounding area) |
3D CAD data read (SolidWorks, Creo (Pro/Engineer), UNIGRAPHICS, Parasolid, SAT, STEP, IGES, etc.) Such |
Temperature contour diagram Speed contour diagram Pressure contour diagram A thermal flux contour diagram Heat conductivity contour diagram Speed vector diagram A thermal flowing vector diagram Joule thermal contour diagram Power -in -container diagram Current density container diagram Such |
Windows 10 Versions 20h2, 21H1 and 21H2 (Pro/Enterprise) Windows Server 2019 Version 1809 (Standard) Such |
Regular analysis / transition (non -normal) analysis Layer style / turbulent Thermal conduction, heating, radiation, including solids and fluids Consideration of gravity and buoyancy (natural convection problem) Analysis in consideration of joule fever Parameter analysis Such |
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About Company Handling This Product
- Japan
- Since 1994
- 250 employees