All operations of contact angle and dynamic contact angle measurement are equipped with automated circular stages DMO-902WA-DMO-902WA
All operations of contact angle and dynamic contact angle measurement are equipped with automated circular stages DMO-902WA-Kyowa Interface Science Co., Ltd.

All operations of contact angle and dynamic contact angle measurement are equipped with automated circular stages DMO-902WA
Kyowa Interface Science Co., Ltd.


About This Product

■ Up to 12 -inch size is a full automatic mechanism of wafer contact square meter equipped with a circular stage that can measure wafer. * A positioning pin that supports 12, 8, and 6 inch weruha can be attached (other sizes and flat plates are used by removing the pin). ・ All operations of contact angle and dynamic contact angle measurement are automated. ・ By driving control in the X -axial direction and rotation direction of the stage, it is possible to fully measure a 12 -inch circular sample. ・ This realizes labor saving and elimination of individual errors of measuring people. -The setting of the sample measurement position is to manually move the stage to the actual measurement position and set it with the "input" button, and to set it by coordinate input on the PC screen.

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    All operations of contact angle and dynamic contact angle measurement are equipped with automated circular stages DMO-902WA




*Please note that we may not be able to accommodate sample requests.

1 Models of All operations of contact angle and dynamic contact angle measurement are equipped with automated circular stages DMO-902WA

Product Image Part Number Price (excluding tax) Extended function (option) Measurement function Measurement target Operability Operation category
All operations of contact angle and dynamic contact angle measurement are equipped with automated circular stages DMO-902WA-Part Number-DMO-902WA

DMO-902WA

Available upon quote Surface free energy, three systems Static contact angle, dynamic contact angle (time -changing) surface / face -faced power (dropping method) Dynamic forward / retreating interruption angle (extension / shrinkage method) Wafer (up to 12 inch size) Automatic Liquid Drop Created Control, Cutting Drop Control, Covering Certificate Automatic X Axis Movement, Automatic X Axis Side Side Moving Automatic Stage Rotation High accuracy, fully automatic measurement

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