ADC_3117 | The most common foam factor PCI Express base FPGA board product in the industry
Fuji Soft Co., Ltd.
Price (excluding tax)
Model Description
■ Overview / features [ADC_3117] High-Density FMC Module The ADC_3117 is a high -density ADC of the FMC HPC (high pins) foam factor with 20 ADC channels of 16 -bit resolution at a 2/5 MSPS sampling rate. The front panel includes two possible status LEDs directly connected to the carrier FPGA, a 10m ADC input channel, a single DAC output, and a 3M SDR connector that provides one external trigger I/O. Equipped. ADC input works in four different modes. There are differential modes, single -end vipolar mode, single -end vipolar mode with offset, and single -end unipolar mode. The front end can be completely corrected in both offset and gain by the variable and fixed voltage source and the DAC output that can be selected from the DAC output. ADC_3117's FPGA design kit can be used with VME64X and MTCA.4 carrier boards (IFC series) of IOXOS Technologies equipped with XILINX Virtex-6T and Kintex Ultrascale FPGA devices. ■ Specifications 1. Single width FMC Vita 57.1-2008 ・ HPC 400 pin connector ・ 3M SDR (SHRINK DELIVERED RIBBON) connector x 2 ・ 3 [W] Standard power consumption 2. 20 channels 16 -bit/14 -bit to 5msps ADC ・ Linear technology LTC2323-16/14 Based on ADC ・ Different or single end can be selected ・ Selected gain: ± 10V, ± 5V, ± 2V, ± 1V ・ DAC for Offset Compensation (± 10V) 3. Two DAC output ・ 16 -bit DAC8563T DAC device ・ Output range: ± 0-10V 4. Two clock rewards, trigger I/O 5. I2C Eeprom connected to FMC SMBUS 6. Temperature monitoring (TMP102) 7. Low noise LDO for on -board ADC power supply * There are other specifications.
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Part Number
ADC_3117
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Handling Company
Fuji Soft Co., Ltd.
The most common foam factor PCI Express base FPGA board product in the industry ADC_3117's performance table
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About Company Handling This Product
- Japan
- Since 1970
- 9,570 employees