The most common foam factor PCI Express base FPGA board product in the industry-Fuji Soft Co., Ltd.

RSP_1461 | The most common foam factor PCI Express base FPGA board product in the industry
Fuji Soft Co., Ltd.


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Model Description

■ Overview / features [RSP_1461] µrtm MTCA.4 Communication Extender RSP_1461 is a rear transition module for extending I/O on the IFC_1410 board. Equipped with seven SFP+port and clock resource. This μRTM is part of the comprehensive MTCA.4 ecosystem based on the following. ・ MTCA.4 line AMC and μRTM modules (CPUS, FMC Carriers, Fast Digitizers and Communication Extenders) ・ High -end set of ADC and DAC module of FMC form factor ・ FPGA design kit for quick integration and customization ・ EPICS SUPPORT ■ Specifications 1. MTCA.4 mid -size double width μRTM form factor 2. I / O extension of IFC_1410 board 3. 7 SFP +ports ・ 1G Ethernet Link x 1 connected to AMC CPU ・ 10G Ethernet Link x2 connected to AMC CPU ・ Serdes of user -definition is directly routed to Amc Central FPGA x 4 4. I2C that makes up SFP+ 5. Clock resource ・ SMA front panel connector x 1 for reference clock input x 1 ・ SMA Front Panel Connector x 1 for reference clock output ・ Additional reference clock on board SMA connector x 3 ・ Clock Synthesizer x 1 6. Custom I/O Mesanin for user -defined applications ・ Eight LVDS I/O wiring directly to AMC Centralal FPGA ・ Three LVDS output directly wiring directly to AMC Centralal FPGA ・ 100MHz reference clock output ・ Programmerable clock output ・ 2C interface 7. DESY D1.4 compliant RTM interface 8. Introduction to EPICS Eco System ■ Provided RSP_1461-A0 Board


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    RSP_1461




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The most common foam factor PCI Express base FPGA board product in the industry-Part Number-RSP_1461 Available upon quote

There are 10 models for this product.

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About Company Handling This Product

Fuji Soft Co., Ltd.

  • Japan
  • Since 1970
  • 9,570 employees

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