Cooling parts heat sink / BGA heat sink-CUI Japan

HSB30-373710 | Cooling parts heat sink / BGA heat sink
CUI Japan

Price (excluding tax)

Estimate Required

Model Description

・ 37.4x37.4mm ・ BGA heat sink ·Made of aluminium ・ PCB

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External dimension LXWXH (inch)

External dimension LXWXH (mm)

Forced air cooling thermal resistance ＠ 1w, 200LFM (° C/W)

Forced air cooling thermal resistance ＠ 1w, 400LFM (° C/W)

Heat resistance for natural air cooling @ 75 ° C ΔT (° C/W)

Heat resistance for natural air cooling ＠ 1w (° C/W)

Material finishing

Package cooled

Power consumption for natural air cooling @ 75 ° CδT (W)

Solder pin direction

material

mount

See all 10 models in list

Part Number
HSB30-373710

Product
Cooling parts heat sink / BGA heat sink

Handling Company
CUI Japan

*Please note that we may not be able to accommodate sample requests.

Cooling parts heat sink / BGA heat sink HSB30-373710's performance table

Items marked with have different values depending on the model number.

Product Image	Price (excluding tax)	External dimension LXWXH (inch)	External dimension LXWXH (mm)	Forced air cooling thermal resistance ＠ 1w, 200LFM (° C/W)	Forced air cooling thermal resistance ＠ 1w, 400LFM (° C/W)	Heat resistance for natural air cooling @ 75 ° C ΔT (° C/W)	Heat resistance for natural air cooling ＠ 1w (° C/W)	Material finishing	Package cooled	Power consumption for natural air cooling @ 75 ° CδT (W)	Solder pin direction	material	mount
	Available upon quote	1.47x1.47x0.39	37.4x37.4x10	Four	2.4	11.63	13.8	Black alumite	Applicable	6.45	No pin	AL6063-T5	PCB

There are 10 models for this product.

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