Copper bump board | Special board
Matsuwa Sangyo
Price (excluding tax)
Model Description
The special plating method allows you to form a bump of about tens to 100 μm in a place where the pattern is required. It is valid when it is required to contact the substrate pad and the installed parts at a high position.
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Part Number
Copper bump board
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Product
Special board
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Handling Company
Matsuwa Sangyo
Special board Copper bump board's performance table
Items marked with have different values depending on the model number.
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There are 3 models for this product.
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