Copper inlay board | Heat dissipation, thick copper, high reliability board
Matsuwa Sangyo
Price (excluding tax)
Model Description
This board is aimed at partially improving the exhaust heat characteristics from the copper pin pressed directly below the heat generated parts. High heat dissipation is achieved by directly contacting the copper with a high thermal conductivity directly with heat generated parts. Compared to the metal -based board, the weight can be suppressed, and that the structure of the substrate so far can be applied as it is.
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Part Number
Copper inlay board
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Handling Company
Matsuwa Sangyo
Heat dissipation, thick copper, high reliability board Copper inlay board's performance table
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There are 4 models for this product.
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