Through hole (TH) thick plating board | Heat dissipation, thick copper, high reliability board
Matsuwa Sangyo
Price (excluding tax)
Model Description
The copper plating thickness required for through holes (TH) is usually about 15 to 20 mm, but in order to increase reliability in TH, a certain thickness (TH FAC) is increasingly required other than in -vehicle use.
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Part Number
Through hole (TH) thick plating board
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Handling Company
Matsuwa Sangyo
Heat dissipation, thick copper, high reliability board Through hole (TH) thick plating board's performance table
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There are 4 models for this product.
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