Heat dissipation, thick copper, high reliability board-Matsuwa Sangyo

Thick copper board | Heat dissipation, thick copper, high reliability board
Matsuwa Sangyo


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Model Description

In recent years, a thick copper board (large -class board) has been required mainly on in -vehicle devices and power electronics equipment, and its demand is increasing. The copper foil thickness of the general printed circuit board is 18㎛ and 35㎛, but by increasing the finished copper thickness to about 210㎛, it also supports large -current circuits.


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    Thick copper board




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