Teflon substrate | High -speed communication / high frequency correspondence group
Matsuwa Sangyo

---

Price (excluding tax)

Estimate Required

---

Model Description

It is a printed circuit board with fluorine resin (Teflon) as an insulated layer. Due to the low ratio and dielectric dialogue, there is a characteristic with less loss of high frequency current. Taking advantage of this characteristics, it is used for high -speed communication (GPS, satellite communication, millimeter wave radar, mobile phone, etc.). Since Teflon has a weak adhesive with other substances, it does not ride or register in the normal board manufacturing process alone. We have introduced a processing (plasma deathmia processing) device that will improve the wetness of the platform and register, so we have realized the integrated manufacturing of the Teflon substrate.

---

Model Filter

You can search for other models from each index. The displayed value is the value of the currently selected part number.

See all 4 models in list

---

• Part Number

  Teflon substrate

• Product

  High -speed communication / high frequency correspondence group

• Handling Company

  Matsuwa Sangyo

---