Faradoflex compatible board | High -speed communication / high frequency correspondence group
Matsuwa Sangyo

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Model Description

Unlike the built -in capacitor material, it is not necessary to create cavity in the substrate, and it is a capacitor material with built -in substrate that features a pattern capacitor circuit in a normal printed circuit board manufacturing process. By reducing the surface implementation parts, the reliability of the connection is increased and the printed circuit board can be miniaturized. In particular, high -frequency substrates eliminate internal wiring, improving inductance, improving impedance, and reducing noise. It is mainly used for high -layered and high -performance routers/server equipment/supercomputers/medical equipment, IC tests, aircraft -related equipment, delicate devices for military use, MEMS microfons aiming for miniaturization, and RF filters.

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• Part Number

  Faradoflex compatible board

• Product

  High -speed communication / high frequency correspondence group

• Handling Company

  Matsuwa Sangyo

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