Price (excluding tax)
A printed circuit board for which a conductor pattern is formed on one -sided/both sides of the insulating plate. It is used in a wide range of fields as a general substrate, and the layer connection of the double -sided substrate is formed by TH (through hole). The base materials are available, such as FR-4, CEM-3, FR-1, halogen-free material, high heat resistance, aluminum, and low-dielectric ratio.
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See all 2 models in listPart Number
One -sided infrastructure / double -sided infrastructureProduct
General penetration boardHandling Company
Matsuwa SangyoItems marked with have different values depending on the model number.
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Available upon quote |