Arrow Industry

A substrate with a structure that does not generate a heat spot with a heat spots with a high heat conduction (1-10W / mK) with...

When considering the use of a metal base board, we recommend a double -sided through hole board when it is difficult to wire pa...

The metal -based single -sided substrate is a printed circuit board that forms an insulating layer and copper foil on the coppe...

• Boards & Circuit Boards

• Metal Base Substrates

In recent years, the number of UVLED high power and the number of wavelengths have increased, and replacements from UV lamps to...

• Semiconductor Manufacturing

• Resists

This is a special heat dissipation board using metal (aluminum / copper) for the core of the double -sided and multilayer subst...

With a vacuum press machine, it will be a multilayer printed circuit board with a laminated four to 24 layers. We will respond...

When implementing parts that generate heat with low energy conversion efficiency, heat dissipation may be insufficient simply b...

It will be a double-sided through hole board based on CEM-3 and FR-4. General flux, solder leveler, gold plating (flash, bondi...

By enhancing the copper foil thickness, many current supply can be supplied, and the advantage is that it is excellent in heat ...

• Boards & Circuit Boards

• High Current PCBs

It is a one-sided substrate made from FR-1, CEM-3, and FR-4. General flux, solder leveler, gold plating (flash, bonding), etc....

This is a heat dissipation board developed to quickly escape the heat of heat generated parts, taking advantage of the high the...

This is a metal substrate that enables high -output device that supports large current by utilizing the heat dissipation charac...

• Boards & Circuit Boards

• High Current PCBs

The multilayer metal substrate is a special heat dissipation board that enables high -densely wiring on both sides or multi -la...

We provide high -density and high -brightness LEDs that implement LED chips directly on high -reflective aluminum materials (95...

This is a hybrid substrate that combines a copper-based board and a galaeepo substrate developed to prevent a connector from de...