TAZMO CO.,LTD.

We support ultra-thin wafers for the purpose of advanced 3D packaging and countermeasures against vulnerabilities caused by dev...

• Testing Equipment

• Semiconductor Inspection Equipment

This is a device that peels off device supports laminated with thermosetting/plastic materials. After mechanical peeling, clean...

• Testing Equipment

• Semiconductor Inspection Equipment

Φ8/12 inch UV curing specification ■Product features ・Fully automatic mass production equipment (coating, drying, alignment, ...

• Machining / Machine Tools

• Coating Process Equipment

The hot phosphoric acid used for nitride film etching increases the concentration of silicon produced during the process, so it...

• Cleaning Agents & Equipment

• Cleaning Systems

This product is a single arm robot specialized for PLP. ■Product features ・Work size: Supports up to 650mm square boards. ・M...

• FA Equipment

• Transfer Machinery

The batch cleaning equipment TIGRIS®200 and TIGRIS®300 are high-performance immersion cleaning and etching systems compatible w...

• Machining / Machine Tools

• Etching Equipment

Single wafer cleaning system CENOTE ® is a multi-functional single wafer cleaning device that uses a multi-cup method. By conti...

• Machining / Machine Tools

• Etching Equipment

This product is a low-cost, high-performance transfer robot developed for EFEM. This is the flagship model of Tatsumo's transfe...

• FA Equipment

• Transfer Machinery

This is a 300mm mechanical clamp aligner that minimizes particle contamination to the wafer with non-contact backside. ■Produc...

• FA Equipment

• Transfer Machinery

The SPR3000 series is Tatsumo's flagship coater/developer specifically designed for high-speed processing. The equipment config...

• Machining / Machine Tools

• Etching Equipment

This equipment is compatible with powdered oxidizing agents (APS) used in metal CMP processes. Powder dissolution, aqueous solu...

• Machining / Machine Tools

• Material Mixers

It achieves low vibration and noise, making it compatible with next-generation semiconductor manufacturing equipment. ■Product...

• Generators

• Vacuum Generators

It has a unique equipment configuration that combines a batch immersion type cleaning module and a single wafer type cleaning m...

• Cleaning Agents & Equipment

• Cleaning Systems

The New MX2000 is a device that dilutes, mixes, and supplies various slurries used in the CMP process. In order to suppress agg...

• Machining / Machine Tools

• Material Mixers

NISON®1800 has been widely used in the semiconductor industry for many years as an indispensable device for etching nitride fil...

• Cleaning Agents & Equipment

• Cleaning Systems

This product is a transfer robot compatible with Φ300mm wafers. ■Product features ・Mapping sensors are also available. ・The ...

• FA Equipment

• Transfer Machinery

■Application example ・Static charge removal before photomask inspection ・Wafer static elimination (circuit damage prevention)...

• Light Sources

• UV Curing Systems

In the hot phosphoric acid process, the silicon concentration is too low immediately after the chemical solution in the treatme...

• Cleaning Agents & Equipment

• Cleaning Systems

ISIS1200J is a device that has two cabinets each with a mixing section, supply section, and tank. Flexible operation is possibl...

• Machining / Machine Tools

• Material Mixers

The CSX2000 series is a coater/developer that has flexibility and expandability in its equipment configuration, and is compatib...

• Machining / Machine Tools

• Etching Equipment

This product is a transfer robot compatible with Φ300mm wafers. This is the flagship model of Tatsumo's transport robot, which ...

• FA Equipment

• Transfer Machinery

■Application example ・Resist hardening ・Nanoimprint curing ・Dicing tape removal ・Lamination UV curing ・Bleaching ・Spectro...

• Light Sources

• UV Curing Systems

EVIO uses advanced technology that suppresses the effects on the bodies of humans and animals while retaining the virus suppres...

• Light Sources

• UV Curing Systems

This product is a unit that performs high-speed, non-contact, orientation flat alignment centering of wafers. ■Product feature...

• FA Equipment

• Transfer Machinery

■Application example ・Laser lift-off (WLP, PLP, etc.) ・Flexible material micromachining (PI, copper, etc.) ・Micro via hole d...

• Light Sources

• UV Curing Systems

■Product features ・High performance metering pump ・High precision nozzle ・Compatible with robot transport ・Equipped with a ...

• Input & Display Devices

• FPD Manufacturing Equipment