Semiconductor laser welding machine LW-D30A/LW-D100-LW-D30A
Semiconductor laser welding machine LW-D30A/LW-D100-Nippon Avionics Co., Ltd.

Semiconductor laser welding machine LW-D30A/LW-D100
Nippon Avionics Co., Ltd.


About This Product

■Various soldering and resin welding The semiconductor laser welding machine LW-D series directly irradiates the resin with the laser emitted from the laser diode and welds the resin without contact. This is a compact, air-cooled laser welding machine that can emit a laser immediately after turning on the switch. Ideal for soldering and resin welding of electronic and automobile parts. ■Suitable for various shapes and materials Equipped with 3 types of output modes (profile, continuous, pulse) ■Visualize laser output waveform Convert and display set numerical data into waveform. Trace display of actual output waveform ■Easy operation Laser emission is possible immediately by turning on the switch. Equipped with a jog dial for easy operation. Guide light equipment for confirming laser emission position ■Ideal for mounting on automatic machines RS-232C, I/O equipment. Rich monitoring (alarm) functions Desktop type, compatible with lead-free solder ■Main uses Soldering, resin welding ■Excitation source current ■Laser medium semiconductor ■Oscillation waveform ・Arbitrary waveform ・Pulse waveform ・Continuous waveform ・Beam profile Features ■High power density with small spot diameter In addition to the standard spot diameter model (MinΦ800μm), a small spot diameter (MinΦ400μm) is also available with an optional lens. ■Lightweight, air-cooled, compact The installation occupies less space, contributing to securing a work area and downsizing the installed equipment. Ejection head included as standard ■Avio's unique profile output It can instantly respond to changes in the shape and thickness of the workpiece.

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    Semiconductor laser welding machine LW-D30A/LW-D100

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1 Models of Semiconductor laser welding machine LW-D30A/LW-D100

Product Image Part Number Price (excluding tax) Alarm function Cooling method Exit head External dimensions/mass Focusing diameter Guide light Interface Maximum power consumption Maximum rated output Monitor display Optical fiber core diameter Output conditions Output control mode Output setting range Power supply Time setting range Wavelength
Semiconductor laser welding machine LW-D30A/LW-D100-Part Number-LW-D30A

LW-D30A

Available upon quote Interlock error, control error, current excess error, power excess error, LD high temperature error, FET high temperature error Air cooling Attached W200xD430xH280mm (excluding convex parts and optical system)
19kg (excluding optical system)
When using the standard attached output head: Φ800μm (WD80mm)
When using additional optional lens: Φ400μm (WD35mm)
635nm I/O, RS-232C (max 57600bps) 800W 26W (Class 4) LD drive current, laser output (digital display, graphic display) Φ400μm 15 conditions CW output, pulse output (single pulse, continuous pulse), profile waveform output (maximum 256 point settings) Current: 3.0-56.4A (0.1A step)
Power: 0.0-26.0W (0.1W step)
AC100V ±10% 50/60Hz 0.000-99.999s (1ms step) 980nm

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