Ultrasonic microscope/ultrasound imaging device V-700
Japan Laser Co., Ltd.
About This Product
Wide range scan model. Demonstrates its power in testing large samples and multiple samples.
■Inspect and observe the inside of an object with high precision and high sensitivity using ultrasonic waves
・Non-destructive inspection tools
・High sensitivity, high definition, low noise
・Ultra high-speed scanning (1.5 times faster than conventional models)
・Easy to use software
・Wide range of application
KSI's V series is a tool that uses ultrasonic waves up to 400 MHz to perform internal flaw detection/internal observation of inspection objects using the principle that ultrasonic waves are reflected at the interface of materials. This series has a wide range of applications, and is used in various fields such as semiconductor packages, electronic components, wafers, ceramic materials, crystal materials, plating, and painting.
For example, in the semiconductor field, it is used as a nondestructive inspection tool to inspect the inside of a package without opening it, and is effective in inspecting peeling/cracks that are difficult to detect with X-rays.
The first feature is high imaging performance. In general, the imaging performance of an ultrasound microscope is greatly influenced by the performance of the ultrasound probe. At KSI, we are leveraging our experience in ultra-high frequency probes that extend to the GHz band to develop high-performance probes in the low to medium frequency bands.
In addition to the above probe technology, high-precision scanners and outstanding image processing technology enable high-definition imaging.
Recently, the importance of ultrasound microscopes has been increasing due to the development and popularization of advanced packaging such as SiP and CSP. is also becoming more and more sophisticated. This series boasts performance that matches these demands.
In particular, it provides images with unprecedented high definition and sensitivity when inspecting wafers (bonded wafers) and stacked chips.
■Sophisticated high S/N, in-house developed probe
The experience cultivated over many years in ultrasound technology, which extends to the GHz band (the only one in the world), is utilized for high-sensitivity imaging. Especially when inspecting wafers (bonded wafers), it has become possible to perform imaging with an unprecedented high SN. Most of our probes are developed in-house, and the V series supports frequencies up to 400MHz.
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Product
Ultrasonic microscope/ultrasound imaging device V-700
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Handling Company
Japan Laser Co., Ltd.
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Categories
1 Models of Ultrasonic microscope/ultrasound imaging device V-700
| Product Image | Part Number | Price (excluding tax) | Frequency band | Number of probe heads installed | Scan range |
|---|---|---|---|---|---|
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V-700 |
Available upon quote | 550MHz | 1 | Max 700mm x 600mm (V-700) ,1,000mm x 700mm (V-1000) |
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