Dimension inspection equipment IC package dimension/surface finish measurement
Japan Laser Co., Ltd.
About This Product
Packaging is the final process for encapsulating semiconductor components in integrated circuits (ICs). Sensofar products connect properly to PCB terminals and pads, allowing you to measure critical pin dimensions and characterize surface finishes.
Measurement of flatness, pin dimensions, etc. in IC packaging using Sensofar products.
■Measurement for wire bonding
With advanced technology, significant improvements have been made in reducing the diameter of gold bonding wires to 30μm. SensoVIEW allows you to create as many profiles as you need and measure critical dimensions. The parameter, which is the difference between the longest point of the wire and the height of the tip, determines whether the wire and tip cover touch or not.
■ Flatness evaluation of QFN terminal pins
One of the most commonly used types of IC packages is the QFN (Quad-flat No Lead) package, which is suitable for many user applications such as consumer, automotive, and power applications. In this case, the evaluation factor is the flatness of the pin. Pin flatness can be evaluated using the SensoVIEW profiling tool.
■ Flatness evaluation of QFN thermal pad
Flatness (Sz) is important for good contact between the pad and the bottom of the chip and proper heat dissipation. SensoVIEW allows you to easily evaluate flatness. To avoid possible spikes in the measurements, flattening and thresholding are applied to obtain the Sz values. By default it calculates the roughness parameter for the dataset. You can then simply save the results of this calculation and apply it to your dataset.
■Measurement of thermal pads using multiple methods
For parts that need to be characterized using multiple methods, SensoPRO can analyze samples with different plug-ins simultaneously for a comprehensive analysis.
■BGA package Height measurement of each ball
BGA (Ball Grid Array) package is a surface mount package structure. The inspection is completed after confirming that each ball is securely connected to the PCB. Sensofar's S neox can be used in conjunction with SensoPRO to quickly and fully automatically measure the height of each ball.
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Product
Dimension inspection equipment IC package dimension/surface finish measurement
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Handling Company
Japan Laser Co., Ltd.
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Categories
1 Models of Dimension inspection equipment IC package dimension/surface finish measurement
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Dimension/surface finish measurement dimension inspection equipment |
Available upon quote |
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