Product
Plastic processing/material Ultra-high molecular weight polyethylene thick plateHandling Company
Murakami Dengyo Co., Ltd.Categories
Product Image | Part Number | Price (excluding tax) | Average particle size μm | Bending strength MPa | Density kg/m3 | Dissipation factor x10-4 | Flexural modulus MPa | Intrinsic viscosity dl/g | Izod impact strength* double notched kJ/m2 | Limit PV value (SUS304, | Linear expansion coefficient x10-4/k | Load deflection temperature (Tf0.45) | MFR | Melting temperature degC | Molecular weight (Mv) | Relative permittivity-- | Sand wear amount | Taber wear amount mm3 | Tensile failure strain% | Tensile fracture stress MPa | Tensile yield stress MPa | Thermal conductivity W/ (m・k) | Volume resistivity Ω・m | Water absorption rate (in water at 23℃) |
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Ultra high molecular weight polyethylene plate |
Available upon quote | 150 | Twenty five | 935 | 2~3 | 1,100 | 14 | 170 | MPa・m/s | 1.5 | 80 | 10 (kg) | 136 | 50 | 2.3 | 3 (hours) | 10 | 350 | 30 | 20 | 0.4 | 1,015~16 | % |