Semiconductor manufacturing equipment CMP (polishing) equipment BC-15CN
Kitagawa Grestech Co., Ltd.
About This Product
■Product information
We provide CMP equipment for testing and mass production according to wafer size. We also accept custom-made products according to customer requests. You can see the actual machine at our technical center.
■About the product
Although it is a desktop type and compact, it is ideal for general CMP testing. Compatible with all kinds of acidic and alkaline slurries. Additionally, this device is designed by downsizing the standard models such as 8" and 12". Therefore, unlike normal tabletop types, it is characterized by high mechanical rigidity.
Therefore, data compatibility is excellent when transferring polishing data acquired with the tabletop type to the stand-alone type. Also, since the load can be adjusted using pneumatic pressure, the flatness is more stable than the normal weight load type.
Another advantage of the weight load type is that when rinsing after polishing, it is necessary to remove the weight and change to a low load, but with the pneumatic load type, it is easy to change from the polishing load to the low load for rinsing. It's a benefit.
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Product
Semiconductor manufacturing equipment CMP (polishing) equipment BC-15CN
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Handling Company
Kitagawa Grestech Co., Ltd.
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Categories
1 Models of Semiconductor manufacturing equipment CMP (polishing) equipment BC-15CN
| Product Image | Part Number | Price (excluding tax) | Compatible Wf size | Compatible applications | Dress size | Footprint (mm) | LD-UnLD | Platen size |
|---|---|---|---|---|---|---|---|---|
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BC-15CN |
Available upon quote | Chip size 100mm | CMP/MEMS/CMP component evaluation 100mm | Φ190mm wheel | W850xD600xH800 | Manual | Φ380mm |
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