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  4. Semiconductor manufacturing equipment CMP (polishing) equipment MAT-ARW-681MSⅡ (Kitagawa Grestech Co., Ltd.)
Semiconductor manufacturing equipment CMP (polishing) equipment MAT-ARW-681MSⅡ-MAT-ARW-681MSⅡ
Semiconductor manufacturing equipment CMP (polishing) equipment MAT-ARW-681MSⅡ-Kitagawa Grestech Co., Ltd.

Semiconductor manufacturing equipment CMP (polishing) equipment MAT-ARW-681MSⅡ
Kitagawa Grestech Co., Ltd.

About This Product

■Product information We provide CMP equipment for testing and mass production according to wafer size. We also accept custom-made products according to customer requests. You can see the actual machine at our technical center. ■About the product Manual loading CMP experimental equipment. Compatible with 3 inch to 200 mm wafers. Equipped with a dress mechanism. Smallest footprint in its class.

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    Semiconductor manufacturing equipment CMP (polishing) equipment MAT-ARW-681MSⅡ

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1 Models of Semiconductor manufacturing equipment CMP (polishing) equipment MAT-ARW-681MSⅡ

Product Image Part Number Price (excluding tax) Compatible Wf size Compatible applications Dress size Footprint (mm) LD-UnLD Platen size
Semiconductor manufacturing equipment CMP (polishing) equipment MAT-ARW-681MSⅡ-Part Number-MAT-ARW-681MSⅡ

MAT-ARW-681MSⅡ

Available upon quote Φ3″~200mm CMP/MEMS/CMP component evaluation Φ100mm sweep W1,375xD855xH2,200 Manual Φ610mm

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Kitagawa Grestech Co., Ltd.

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