■Features
・Through-hole solder filling inspection and BGA void inspection are possible.
・2D, 2.5D, 3D slice, and 3D volume inspection in one
・Summary of ultra-high performance X-ray inspection equipment
・Achieving the highest inspection accuracy with cutting-edge AI solutions (i-TOP: equipped with automatic overlap processing)
・Full support for data tracing by integrating MES, ERP/verification review station
・Includes easy-to-use self-developed 3D analysis software
・Real-time measurement of radiation leakage. Radiation protection standard products (IEC standards)
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