Dissimilar materials joining equipment Direct joining of resin and metal-Dissimilar materials joining equipment Direct joining of resin and metal
Dissimilar materials joining equipment Direct joining of resin and metal-Nippon Avionics Co., Ltd.

Dissimilar materials joining equipment Direct joining of resin and metal
Nippon Avionics Co., Ltd.


About This Product

■Overview of dissimilar materials joining equipment We have developed a dissimilar material bonding device for resin and metal that uses a dry process method that does not use adhesives. This equipment consists of a laser processing station, a plasma processing station, and a thermocompression bonding station using pulse heat.It starts with laser processing to form fine irregularities on the surface of metal materials, and then uses plasma to clean the surfaces of metal and resin materials. , and achieves high bonding strength when joining dissimilar materials through a thermocompression bonding process using pulsed heat. Each station is independent, allowing for flexible layouts even in limited installation areas. ■Applicable examples ・Resin battery ・Wearable terminal ・Medical equipment ・Sensor electrode ·connector ■Features of our uniquely developed dissimilar material joining equipment The dissimilar material joining technology of resin and metal is a joining technology that joins thermoplastic resin (resin that softens when heated and hardens when cooled) and various metals. Various resins and metals can be directly joined without using chemicals. Five points of dissimilar materials joining equipment ■[Point 1] Environmentally friendly It is an environmentally friendly joining technology because it does not require fastening parts such as screws or bolts, and it is directly joined without using adhesives. ■[Point 2] Low equipment cost Since injection molding is not used in the joining process, there is no need for molds or large-scale equipment, and the equipment cost is low. ■[Point 3] Ideal for small areas and thin metal materials This joining technology is ideal for small areas and thin metal materials because it joins with a pulse heat unit used for precision soldering. ■[Point 4] Precise temperature profile By controlling the heating temperature while monitoring the temperature at the joint, defects such as overmelting can be reduced. In addition, by applying pressure to the temperature at which the resin hardens, this joining technology eliminates the stringiness of the resin. ■[Point 5] Integrated device ideal for research use ・The three stations of laser, plasma, and pulse heat are packaged into one and can be used immediately after installation without any additional equipment. ・Since each station is independent, flexible layout is possible even in limited space. ・Surface treatment is a dry process that does not use chemicals and has the effect of mechanical and chemical bonding. These features make it easy to install and handle in laboratories.

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    Dissimilar materials joining equipment Direct joining of resin and metal

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1 Models of Dissimilar materials joining equipment Direct joining of resin and metal

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Dissimilar materials joining equipment Direct joining of resin and metal

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