■Device performance
・This device is mainly a semi-automatic measuring device that measures surface defects in single crystal materials. The data collected by the SCM system is processed by a computer analysis system to obtain pick angle and (FWHW) values. This determines the completeness of the crystal surface growth.
・This device can measure both wafers and ingots.
・Able to measure angle values of various types of single crystal materials
- Single measurement time is 18'' (scan angle range ±5'), single or repeated measurement is possible, repeatability is ±2'' (measured with sapphire polished tip).
■Accuracy
Measured with a sapphire polished tip, accuracy is ±5″, minimum reading is 1″ (device display: degrees, minutes, seconds)
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