Price (excluding tax)
■ Overview / features Axela Letter card with Stratix 10 FPGA and HBM2 that is ideal for AI The 520NX, designed to deal with the most strict artificial intelligence workload, is a PCIE card equipped with Intel's Stratix 10 NX2100FPGA. This innovative accelerator offers a unique combination of functions required to implement a larger AI model at low delay. ・ High-Performance AI Tensor Blocks: 143 INT8 TOPS ・ DEEP NEAR-COMPUTE MEMORY: Up to 8GB of HBM2 ・ High-bandwidth networking: UP to 600Gbps Board-to-BOARD BANDWIDTH The 520NX has a Board Management Controller (BMC) for advanced system monitoring and control, greatly simplifying the integration and management of the platform. ■ SFP cage ・ 4 QSFP28 cages of the front panel connected directly to FPGA via 16 transceivers ・ 10/25/40/100 GBE User programable low jitter crocking ・ Each QSFP28 can clock independently ・ Jitter cleaner for network recovery clocking ・ 100GBEMAC hard IP is available for two QSFP28 ■ Board management controller ・ Voltage, current, temperature monitoring ・ Power sequence and reset ・ Field upgrade ・ FPGA configuration and control ・ Clock configuration ・ BMC-FPGA communication with low bandwidth using SPI link ・ USB 2.0 ・ PLDM support ・ Voltage override
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Board Management Controller
External memory
Foam factor
Fpga
Host interface
Oculink
On -board flash
cooling
environment
power supply
quality
Part Number
520nxHandling Company
Fuji Soft Co., Ltd.Items marked with have different values depending on the model number.
Product Image | Price (excluding tax) | Board Management Controller | External memory | Foam factor | Fpga | Host interface | Oculink | On -board flash | cooling | environment | power supply | quality |
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Available upon quote | can be | The 2X 288 -pin DIMM slot is 16GB module (on board for 32GB (up to 256GB for options)) | Standard height PCIe dual slot board, 4.376 x 10.5 inches (111 x 266.7mm) | Intel Stratix 10 NX, F2597 package NX2100, 8GB's on -chip high bandwidth memory (HBM2) DRAM, 410GB/s (speed grade 2), etc. | X16GEN3 interface directly connected to FPGA connected to PCIe hard IP | 2X edge comector (a, b) @12.5g per lane (default): Each supports PCIegen 3 X8 Hard IP, GPIO, PCIe master and optional input clocking, etc. | 2G -bit flash memory to launch FPGA | Standard: DOUBLE-WIDTH ACTIVE HEATSINK (With Fan), Optional: Double-Width Passive Heatsink, etc. | Operation temperature: 5 to 35 ℃ | On -board power supply obtained from 12V PCIe slot and two AUX connectors (one for 8 pins, one is 6 pins), power consumption depends on the application, standard maximum power consumption 225W | ISO9001: 2015IPC-A-610-Manufacture, ROHS compatible, CE/FCC/ICES approval in conjunction with class III |