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F & K DELVOTEC Bondtechnik
F & K DELVOTEC Bondtechnik's Company Profile and Products
Overview
F & K DELVOTEC Bondtechnik GmbH, founded in 1978, is a manufacturer headquartered in Ottobrunn, Germany, specializing in assembly and joining technologies for semiconductor and microelectronics manufacturing.
F & K DELVOTEC develops technology and solutions for manual, partial, and full automation of wire bonding. The company also provides services covering machine selection and configuration, buffer station and magazine coupling, as well as feeding system integration for various industries, including the semiconductor, automotive, and photovoltaic sectors. Recognizing the growing demand for power electronics, the company also develops laser bonding technology to join aluminum and copper ribbons on direct copper bonding (DCB) substrates.
Profile
Products
1 F & K DELVOTEC Bondtechnik's product is listed.
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