Semi Next Co., Ltd.

■Full test at low cost. The sealed structure of the probe ensures the safety and reliability of the press Our "KGD" is an inspe...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Complete hardware protection for each circuit Supports simultaneous burn-in of up to 6 or 12 wafers "Wafer level burn-in" can ...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Significantly improved production efficiency. Burn-in conditions can be set freely for each jig, making it convenient for rese...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Fully automatic COC inspection equipment for high power LD (laser diode) We would like to introduce our ``High Power LD (Laser...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■The inspection jig is shared with the burn-in system. Significantly improved inspection direct rate and inspection stability T...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Significantly improved production efficiency. Burn-in conditions can be set freely for each jig, making it convenient for rese...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

■Inspect 2pcs LD chips simultaneously under different temperature conditions! Inspection equipment compatible with LD chips suc...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining

The DCA4201 is based on equivalent time sampling and reconstructed eye-pattern technology, enabling higher-precision, lower-cos...

• Measuring Equipment

• Sampling Oscilloscopes

■Independent control is possible for each single layer. High power laser heat dissipation with water cooling system + TEC We wo...

• Semiconductor Manufacturing

• Semiconductor Manufacturing Equipment Component & Part Machining