Cutting Machinery
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Substrate Cutting Machines
Storage Batteries
Nippon Gijutsu Sangyo Co., Ltd.
210+ people viewing
Last viewed: 3 hours ago
■Dicing saw Cutting equipment used in the semiconductor chip production process. Machining is done by rotating a rotary blade e...
Nippon Gijutsu Sangyo Co., Ltd.
180+ people viewing
Last viewed: 9 hours ago
■Dicing saw Cutting equipment used in the semiconductor chip production process. Machining is done by rotating a rotary blade e...
Nippon Gijutsu Sangyo Co., Ltd.
150+ people viewing
Last viewed: 2 hours ago
The 7120/7130 family of 2-inch and 4-inch spindle dicing systems offers a high level of affordability and flexibility to suppor...
Nippon Gijutsu Sangyo Co., Ltd.
140+ people viewing
Last viewed: 6 hours ago
The 7120/7130 family of 2-inch and 4-inch spindle dicing systems offers a high level of affordability and flexibility to suppor...
Nippon Gijutsu Sangyo Co., Ltd.
140+ people viewing
Last viewed: 2 hours ago
The 7120/7130 family of 2-inch and 4-inch spindle dicing systems offers a high level of affordability and flexibility to suppor...
Nippon Gijutsu Sangyo Co., Ltd.
140+ people viewing
Last viewed: 11 minutes ago
The ADT8020 dicing system has two opposing spindles that can dice wafers simultaneously at high throughput. The ADT8020 is a hi...
Nippon Gijutsu Sangyo Co., Ltd.
140+ people viewing
Last viewed: 2 hours ago
The 7120/7130 family of 2-inch and 4-inch spindle dicing systems offers a high level of affordability and flexibility to suppor...
Nippon Gijutsu Sangyo Co., Ltd.
130+ people viewing
Last viewed: 17 minutes ago
The ADT8030 dicing system has two opposed spindles that can simultaneously dice wafers at high throughput. The ADT8030 is a hig...
Country | Japan |
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Website | Nippon Gijutsu Sangyo Co., Ltd. Website |